Exclusive die shots of Apple A18 and A18 Pro reveal distinct architectural designs.

    Apple introduced the A18 and A18 Pro chips alongside the iPhone 16 series, and the differences between the two are already generating buzz. The A18 Pro is touted as having a more powerful GPU, making it better suited for high-end tasks like augmented reality, 3D rendering, and even ray tracing.

    Recently, images of the actual chips surfaced online, showing that while both the A18 and A18 Pro are built using TSMC’s 3nm process, they’re not as similar as one might expect. The A18 Pro chip, in particular, stands out with more transistors, which should translate into better overall performance. That’s key for those who rely on their iPhones for graphically demanding tasks.

    TSMC used its InFO-PoP (Integrated Fan-Out Package-on-Package) technique to stack the DRAM directly on top of the SoC die. This method not only reduces the overall size of the chip but also improves thermal and electrical performance, both important factors in keeping these high-performance chips running smoothly under heavy loads.

    There’s been talk that Apple is reserving the even more advanced 2nm technology for the A19 chips, but it seems we might not see that leap until the iPhone 17 Pro models. Rumors are suggesting that TSMC is facing some yield issues with the 2nm process, which could explain the delay.

    While it’s clear that the A18 Pro packs a punch, I’m really curious to see how Apple balances performance and efficiency in future chip iterations. For now, though, the A18 series is another step forward in pushing mobile performance to new heights.

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    Carter (Apple Boy)
    Carter (Apple Boy)
    I am the Owner of HexaCore. I just love using Apple devices. Yes iPhone, a MacBook, Airbuds and an Apple Watch. I love their sleek designs and unqiue ideas. Writing about Apple products and updates is my hobby now.